On October 22, 2026, JCET Group (600584.SH) released its third-quarter report for 2026. The report indicates that for the first three quarters of the year, the company achieved an operating revenue of RMB 30.95 billion—an 8% year-on-year increase and a new record for the same period in the company's history. Net profit attributable to shareholders of the listed company reached RMB 1.62 billion, up 69.6% year-on-year, while net profit attributable to shareholders of the listed company—excluding non-recurring gains and losses—stood at RMB 1.56 billion, representing a 99.2% year-on-year increase.

In the third quarter of 2026, the company recorded an operating revenue of RMB 11.43 billion, marking a 13.5% year-on-year increase and a 10.3% quarter-on-quarter increase—a new all-time high for a single quarter. Net profit attributable to shareholders of the listed company reached RMB 770 million, up 60% year-on-year and 39.4% quarter-on-quarter. Both the scale of operations and profitability have shown consistent quarter-over-quarter growth throughout the year.

In the first three quarters of this year, JCET's gross profit margin increased by 2.3 percentage points year-on-year. This improvement was primarily driven by the optimization of product structures at the company's domestic and international facilities. Furthermore, the company's strategic positioning in advanced packaging has begun to yield results, with its comprehensive technical capabilities and the advantages of its global, large-scale manufacturing footprint increasingly coming to the fore.

About JCET

In recent years, JCET has remained steadfast in focusing on its core business. Capital expenditures have been directed toward the development of advanced packaging technologies and the expansion of advanced manufacturing capacity. By prioritizing the enhancement of profitability within its primary operations—rather than pursuing short-term gains through financial investments in the capital market—the company has effectively driven the growth of its net profit (excluding non-recurring items). This approach has laid a solid foundation for corporate innovation, operational efficiency, and long-term, sustainable development. In alignment with its strategic planning and business growth requirements, the Board of Directors of JCET has approved an upward adjustment to the company's fixed-asset investment plan for 2026, increasing it from RMB 9.98 billion to RMB 17.31 billion.

Throughout this year, JCET has continued to optimize its technology, production capacity, and customer footprint, with a focus on key application sectors. The computing electronics segment addresses the demands for processing power, storage, interconnectivity, and power supply essential for AI computing centers. In the first three quarters, revenue from this segment grew by 54% year-on-year, accounting for 30.9% of the company's total revenue. In the automotive electronics sector, revenue increased by 30% year-on-year, supported by the gradual ramp-up of production capacity at the Shanghai Lingang automotive electronics facility and an enhanced capability for large-scale delivery. To capitalize on structural growth opportunities, the company has accelerated the development of high-end advanced packaging capacity. During the first three quarters, JCET Microelectronics (Jiangyin) Co., Ltd.—which specializes in high-end advanced packaging—expanded its production capacity, while the new high-end advanced packaging project in Shanghai Lingang has continued to progress steadily.

JCET Group targets AI

In the realm of cutting-edge technology, JCET (Jiangsu Changjiang Electronics Tech) is continuously refining its technology roadmap and product portfolio to address the new requirements—such as high-density heterogeneous integration, low-power interconnects, and efficient power delivery—driven by AI and high-performance computing. The company is collaborating with various clients on the development of technologies including glass substrates and panel-level packaging (PLP), with related projects now advancing to the pilot production line stage. In the field of Co-Packaged Optics (CPO), leveraging its XDFOI® advanced packaging platform, JCET has established capabilities for the heterogeneous integration of Photonic Integrated Circuits (PICs) and Electronic Integrated Circuits (EICs), as well as the co-packaging of optical engines with switching and computing chips.

Simultaneously, the transformation of the company's overseas operations is accelerating. The facility in South Korea is ramping up the introduction of high-end advanced packaging projects for leading international wafer foundries and clients in the AI sector, while the Singapore facility is shifting its focus toward high-value-added segments such as data centers. By utilizing its global manufacturing and service network—spanning China, South Korea, and Singapore—JCET continues to capitalize on the synergies between its various sites. This strengthens its ability to provide R&D support, large-scale manufacturing, and supply chain assurance to global customers, while further refining its worldwide manufacturing and collaborative delivery system.

Source: Content adapted from JCET's official WeChat account

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