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EDA Undergoes Major Changes

In the 1980s, it was often said that "buying an IBM will never cost you your job." Even with the emergence of new technologies, IBM remained a safe choice. While it may not have been the most...

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Renesas, huge losses

Japanese chipmaker Renesas Electronics announced that it expects to post its first net loss in six years in 2025, due to weak demand for its main automotive chips and a low percentage of revenue fr...

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Breakthrough in EUV Lithography Machines: Full Technology ...

ASML, the world's leading lithography equipment manufacturer, announced that it has found a way to enhance the light source power of chip manufacturing equipment, which is expected to increase chi...

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Three major advancements in the chip industry

The shrinking size of devices necessitates increasingly smaller metal lines and dielectric gaps, making resistance, capacitance, and material stability the primary limiting factors.

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Memory chips, a new competition

Low-power dynamic random-access memory (LPDDR) is emerging in the artificial intelligence (AI) memory market. It is gaining attention as an alternative, promising to address AI bottlenecks ...

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PCIe 8 SerDes is coming

Marvell today announced that it will showcase PCIe® 8.0 SerDes at its booth 904 at DesignCon 2026, held at the Santa Clara Convention Center in California from February 24 to 26. SerD...

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Is AMD in a panic after selling 3.3 million GPUs?

AMD has just announced an agreement with Meta Platforms that is strikingly similar to the agreement it signed last October with model-building company OpenAI, from a total data center capacit...

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How is Chiplet progressing?

Jim Handy of Objective Analysis and Jawad Nasrullah of Palo Alto Electron made predictions at last week's Chiplet Summit, outlining the future direction of the Chiplet market and why Chip...

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TSMC to build 5 more wafer fabs in the United States

According to three sources familiar with the matter, the Trump administration is finalizing a trade deal with Taiwan that would lower tariffs on Taiwanese exports and prompt TSMC, Taiwan's la...

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Intel's advanced packaging

Intel compared its EMIB interconnect solution to traditional 2.5D technology and demonstrated its advantages in designing advanced packaged chips.

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Giants compete for glass substrates

As the commercialization of glass substrates (a key technology for next-generation semiconductor packaging) draws ever closer, companies like SK, LG, and Samsung are rapidly expanding their coll...

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South Korean media: Samsung's 2nm process was almost translated...

TSMC is expanding its leading position in the cutting-edge wafer foundry market. The company significantly increased its 3nm process sales share in the fourth quarter of last year and plans to be...

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