The demand for AI servers and high-performance computing (HPC) continues to rise, driving chip power consumption rapidly toward the kilowatt (kW) level. Power efficiency and power integrity have become the battleground for new semiconductor technologies.

Supply chain sources revealed that UMC's embedded deep trench capacitor (DTC) technology, which it has been actively developing in recent years, has successfully entered Qualcomm's supply chain, and related products have begun to ship, marking another victory in the field of advanced packaging.

UMC responded that it would not comment on individual customers, but advanced packaging is a technology the group is actively strengthening. Industry insiders point out that the computing power of AI chips has increased significantly, and GPUs, AI accelerators, and edge AI chips have increasingly higher demands for "instantaneous power supply." Traditional packaging architectures are no longer sufficient to meet the requirements of low-noise, high-efficiency power management.

DTC technology, by embedding high-density capacitors within the silicon interposer or advanced packaging substrate, significantly shortens the power supply path, reduces parasitic effects and power noise, and improves chip operational stability and performance, becoming one of the key technologies for advanced packaging. In recent years, DTC has become an important technology for international manufacturers developing advanced packaging, including TSMC's CoWoS and Intel's EMIB high-end packaging platforms, all of which have actively adopted related technologies to address the power supply challenges brought about by the continuously rising power consumption of AI chips.

Industry insiders point out that UMC has been continuously deepening its expertise in specialty process technology in recent years. Having developed DTC (Direct-to-Consumer) technology for many years, it now possesses mass production capabilities, and its related products have successfully entered Qualcomm's supply chain. Industry analysts are optimistic that UMC will capitalize on the rapid growth of edge AI devices, including AI PCs, smartphones, smart glasses, and various terminal devices, all of which are expected to be important application areas for DTC technology.

Analysts believe that in addition to consolidating its position in mature process technologies, UMC has also enhanced the added value of its products through specialty processes and advanced packaging technologies. DTC, for example, has high technical barriers and long customer verification cycles. Once successfully implemented in a customer's platform, the supply relationship is usually relatively stable, which helps to sustain long-term operating momentum. Overall, analysts believe that UMC's successful entry into Qualcomm's supply chain highlights its technological strength in the fields of specialty processes and key components in advanced packaging.

Embedded deep trench capacitor technology solves power supply pain points

The AI wave is driving explosive demand for high-performance computing (HPC) and AI servers. Increased chip performance is leading to higher power consumption, and industry experts predict that next-generation AI accelerators will consume kilowatts (kW). This necessitates providing stable and efficient power within advanced packaged chips, achieving instantaneous power delivery. This has brought embedded deep trench capacitor (DTC) technology into the spotlight.

Industry experts point out that DTC involves etching deep trench structures within silicon chips using semiconductor processes to create high-density capacitors, which are then integrated into the silicon interposer or advanced packaging architecture. Compared to traditional processes that place capacitors on the packaging substrate or circuit board, DTC allows for closer proximity to the computing chip core, significantly shortening the power supply distance, reducing voltage fluctuations and power noise, and improving system stability.

Analysts believe that DTC can be applied not only to AI accelerators and GPUs but also to networking, automotive electronics, and high-end mobile processors. Companies with the relevant technology and mass production capabilities have the opportunity to become key beneficiaries of the next wave of industrial upgrades as AI applications grow.

Besides cloud-based AI servers, the edge AI market also presents significant opportunities for DTC (Distributed Treasure Chemistry) companies. Industry experts add that as AI PCs, smartphones, AR glasses, and various smart terminal devices increasingly incorporate generative AI capabilities, the demands on chip computing performance and energy efficiency are simultaneously rising, leading to a surge in demand for related power management technologies.

Industry analysts explain that AI chips often experience sudden and significant current fluctuations during high-speed computation. If the power supply system reacts slowly, it impacts chip performance. DTC, with its advantages of high capacitance density and low parasitic effects, provides solutions for meeting instantaneous current requirements, making it a solution for improving power integrity through advanced packaging.

Source: Content compiled from Semiconductor Industry Observer

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