Texas Instruments (TI) has officially achieved Bluetooth SIG certification for its CC27xx-Q1 series of wireless MCUs, becoming the industry's first automotive-grade product family to achieve Bluetooth® 6.0 channel sounding certification and enter mass production. This not only represets another technological breakthrough for TI in wireless connectivity, but also brings Bluetooth channel sounding from "theory" to "reality," enabling high-precision ranging and ultra-low-power connectivity to mass production applications.

During the critical stage of Bluetooth 6.0 standard implementation, TI achieved industry-first launches, series production, and scalable ecosystem compatibility, completing certification and mass production in less than a year. TI was the first to launch a complete and scalable wireless MCU product line, capturing the Bluetooth 6.0 market and accelerating the innovation and implementation of next-generation smart devices.

CC27xx-Q1 Series:

A Triple Breakthrough in Performance, Security, and Scalability

• The industry's first automotive-grade low-power wireless MCU series with an integrated channel sounding coprocessor, certified for Bluetooth channel sounding and now in mass production:

  This series offers comprehensive improvements in latency, power consumption, and algorithm flexibility, enabling high-precision ranging and stable communication.

• Certified to the latest automotive cybersecurity standard ISO 21434:

  Integrated hardware security modules, voltage fault monitoring, and DPA protection meet automotive-grade safety and reliability requirements.

• One design, multiple expansion options:

  Providing pin- and software-level compatibility, it covers multiple power versions, including +20 dBm and +10 dBm. This allows customers to flexibly expand their product portfolio with a single design, achieving the optimal balance between system-level performance and cost.

As cars become more centralized and intelligent, TI MCUs have not only achieved Bluetooth SIG and automotive certification, but also provide automotive manufacturers with a highly integrated, automotive-grade modular platform for complex in-vehicle wireless network environments. This unified hardware and firmware architecture enables rapid verification of precise ranging and low-latency communication capabilities, reduces power consumption, reduces design and certification cycles, and accelerates the mass production of innovative applications.

Texas Instruments China

Cai Zheng, General Manager of Automotive Electronics OEM Business, said:

With the industry's first automotive-grade, mass-produced low-power wireless MCU certified for Bluetooth channel detection, Texas Instruments is helping automakers create safer, smarter, and more connected mobility experiences. This Bluetooth SIG-certified solution enables features such as digital key and low-latency in-vehicle connectivity, helping customers lay a solid foundation for next-generation in-vehicle intelligence and sensor networks.

Source: Semiconductor Industry Observer

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